International Engineering Consortium's Euro DesignCon 2004 to Offer a Series of Complimentary Educational Programming Business Editors Euro DesignCon 2004 CHICAGO
(BUSINESS WIRE)--Aug. 16, 2004-- Free programs enable attendees to sample Euro DesignCon 2004's array of quality education The International Engineering Consortium (IEC) has announced that this year's Euro DesignCon, the educational conference and exhibition for practicing engineers in the electronic-design and semiconductor industries, will feature a series of free educational programs coupled with the technology exhibition, which will provide attendees with a multitude of opportunities to sample the four-day forum's quality education.
The series of free programming will feature three keynote addresses, one plenary panel, and five technical conference panels.
Delivering the keynote addresses will be industry luminaries Dr. Hugo De Man, Co-Founder and Senior Research Fellow, IMEC; Dr. Andreas von Zitzewitz, Member of the Management Board and Chief Operating Officer, Infineon Technologies; and Ned Barnholt, Chairman, President, and Chief Executive Officer, Agilent Technologies.
Euro DesignCon 2004's plenary panel, chaired by Wolfgang Rosenstiel, Professor, University of Tuebingen, Germany, will discuss the current state of design at the system level and the tools that support it in "System-Level Design: Where is EDA?". Panelists will include industry executives and technical leaders from Celoxica, Synopsys, STMicroelectronics, and Infineon Technologies.
Technical conference panels, organized by such leading companies as Mentor Graphics, IBM, TSMC, LSI Logic, ARM Ltd., and edacentrum, will hold discussions on current issues facing design engineers. Each of the five conference panels will bring together experts on the appointed topics for lively and informative conversations. Panels include "Who Benefits from Assertions?", "Design-for-Test Considerations for Mergeable Cores", "Design Productivity: What Is It, and Why Measure It?", "Have FPGAs Hit the Wall? Is ASIC Dead? What Silicon Solutions Should You Pick?", and "Design-for-Manufacturing to Minimize the Number of Re-Spins".
"A unique and distinguishing feature of DesignCon events is their array of high-quality complimentary educational programs presented by venerable members of the semiconductor and electronic-design communities," explains John Janowiak, Senior Director of the IEC.
In addition to panel discussions and singular addresses, Euro DesignCon 2004's hands-on free programming is complemented by an impressive technology exhibition featuring EDA tool providers, semiconductor vendors, IP providers, and system OEMs. Attendees will benefit from the opportunity to meet leading companies from around the globe which will be demonstrating their latest products, offering firsthand looks at those products' functionalities.
In addition to its abundant complimentary curriculum, Euro DesignCon 2004 features paid educational conference programming including 40 technical papers and seven TecForum tutorials that will provide in-depth perspectives on the topics of Design Verification, Silicon System Design, Chip-Level Physical Design, Test and Debug, High-Speed Interconnect Systems, Automotive System Design, and Wireless Communication System Design.
Euro DesignCon 2004 will take place 11-14 October 2004 at the ArabellaSheraton Grand Hotel in Munich, Germany. Registration and program information for Euro DesignCon can be found at www.designcon.com/euro.
About DesignCon Events (www.designcon.com) DesignCon, DesignCon East, and Euro DesignCon conference programs provide education and updates on the latest technology advances affecting engineers working at the chip, board, and system levels. DesignCon technology exhibitions deliver practical approaches, techniques, and procedures directly on the show floor, where leading-edge displays from key organizations offer proven solutions for immediate application.
About the IEC (www.iec.org) The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association.
CONTACT:
The International Engineering Consortium (IEC)
Lynne Bobak, 312-559-3862 lbobak@iec.org
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