International Engineering Consortium's Euro DesignCon 2004 to Feature Vast Array of Technical Papers

CHICAGO--(BUSINESS WIRE)--Aug. 24, 2004--

Committee of Distinguished Design Engineers Selects Papers for Presentation at Event That Will Include Highly-Focused Educational Tracks

The International Engineering Consortium (IEC) has announced that the Technical Program Committee of its newest event, Euro DesignCon 2004, has selected 40 papers for presentation from the more than 120 that were submitted by practicing engineers in the semiconductor and electronic-design industries.

Each paper offers in-depth perspectives that will be presented during a 45-minute session that falls within one of the following technical tracks: Design Verification, Silicon System Design, Chip-Level Physical Design, Test and Debug, High-Speed Interconnect Systems, Automotive System Design, and Wireless Communication System Design.

"A hallmark of DesignCon events is that we delve deeply into the most critical challenges facing semiconductor and electronic-design engineers and develop a very in-depth learning forum that will yield solutions that can be implemented immediately in their designs," explained John Janowiak, Senior Director of the IEC.

Janowiak cited the event's Technical Forums as another example of Euro DesignCon 2004's highly focused learning environment, where an array of subjects will be examined including "Advances in Platform ASICs," "M-LVDS in Practice: New Life for Multipoint Buses," "Applying Physics-Based Analysis to the Design and Verification," and "Signal Integrity Analysis for Clock and DataCom Applications."

Based on the IEC's highly successful DesignCon program in the United States, Euro DesignCon 2004's presentations will address current issues that are of most significance to the European semiconductor and electronic-design communities. In addition to the technical paper presentations and Technical Forums, the event will offer a comprehensive educational program of keynote addresses, plenary and technical panels, and a hands-on technology exhibition featuring more than 30 industry-leading companies.

Euro DesignCon 2004 will take place 11-14 October 2004 at the ArabellaSheraton Grand Hotel in Munich, Germany. Registration and program information for Euro DesignCon 2004 can be found at http://www.designcon.com/euro.

About DesignCon Events (www.designcon.com) DesignCon, DesignCon East, and Euro DesignCon conference programs provide education and updates on the latest technology advances affecting engineers working at the chip, board, and system levels. DesignCon technology exhibitions deliver practical approaches, techniques, and procedures directly on the show floor, where leading-edge displays from key organizations offer proven solutions for immediate application.

About the IEC (www.iec.org) The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association.

Lynne Bobak,