Ormecon introducing ultrathin new Organic Nanometal
Hamburg, Germany:
First industrial line being installed in Korea
A completely new nano size surface finish is introduced by Ormecon International into the Printed Circuit Board market. The thickness is only 55 nanometres, the layer consists of a nanoparticle complex formed between the Organic Nanometal and Silver (the Silver only contributes up less than 10% to it).
Nonetheless, this ultrathin layer provides a much more powerful oxidation protection and solderability preservation than any other established metallic finish - although the established finishes are between 6 and 100 times thicker than this new nanofinish.
According to Ormecon, several tests in many companies in the electronics industry have already shown a superior thermal resistance and perfect solderability.
Only three months after the first public presentation by Dr. Bernhard Wessling, the inventor and Ormecon CEO in July 2007, a first industrial line for the deposition of the new nanofinish will be installed in Korea at Ormecon�'s customer YooJin. The line will go into operation in the second half of October.
It will be the first commercial line to provide a nano sized surface finish for printed circuit boards.
The energy consumption will only be 10 - 30%, the total environmental resource consumption is less than 1% compared to conventional surface finish processes.
More information is available on Ormecon�'s website www.ormecon-nanotech.com.
Background information:
Printed Circuit Boards (PCB) are the basis for any electronic control in computers, mobile phones, printers, TVs, and of all electric and electronic control tasks in cars, airplanes, satellites, elevators, dish washer, washing machines, refrigerators and even modern coffee machines.
Chips and other electronic components are being fixed (soldered) on defined locations on the printed circuit board, and the board contains the circuit by which the components are connected with each other.
The manufacturing of the fully functioning PCB is separated in the industry, first, the PCB manufacturer produces the bare board with the circuit, then the so-called "assembler" puts the electronic components on the boards and fixes them firmly by soldering.
This positioning and soldering process is fully automatic, is running for several times at peak temperatures or around 260 °C and therefore requires a 100% guarantee that every of the many 100 partially microscopically small Cu locations will accept the solder and form a connection which is stable for many years even under temperature changes between low arctic or even lower space temperature, up to high operating temperatures like 80 or 150 °C close to motors or within a laptop, regardless whether under constant vibrations (like in a car or airplane) or not.
Therefore, the final surface finish is the most critical step on the PCB manufacturing, and the new Nanofinish is promising to revolutionize surface finishing of PCBs.
Ormecon International is a small internationally operating group companies, founded by Dr. Bernhard Wessling who discovered and introduced the new nanomaterial class of Organic Metals.
Contact Information:
Dr. Bernhard Wessling, Ormecon GmbH, wessling@ormecon.de
Phone: +49-40-60410618